Enflame debuts glass-based CoPoS AI chip sample at WAIC 2026

At the World Artificial Intelligence Conference (WAIC) 2026, Enflame, a Chinese AI chip developer, jointly showcased an AI chip sample with Shanghai Xianfeng Technology that employs glass-based Chip-on-Panel-on-Substrate (CoPoS) technology. CoPoS is a panel-level advanced packaging methodology that represents a departure from conventional chip assembly. The use of glass as the substrate material in this panel-on-substrate approach distinguishes it from traditional approaches. The article does not provide information on the sample's performance specifications, manufacturing timeline, cost structure, or competitive positioning against other advanced packaging solutions in the market.

Enflame's debut of a glass-based CoPoS AI chip sample at WAIC 2026 signals a shift in advanced packaging strategies within China's AI hardware sector. CoPoS represents a panel-level assembly approach that moves away from traditional discrete chip packaging, potentially offering manufacturers greater flexibility in layout and integration. The joint effort with Shanghai Xianfeng Technology, a supplier or partner in panel-level technology, suggests collaboration across the supply chain to advance this alternative packaging method. While the article does not disclose performance metrics, cost advantages, or production readiness, the public showcase at a major AI conference indicates the technology has reached at least a demonstration phase.