Applied Materials and Broadcom partner to accelerate advanced chip packaging technologies for AI systems

On May 20, Applied Materials Inc. (NASDAQ:AMAT) announced a collaboration with Broadcom to enhance development of advanced chip packaging technologies for AI systems. Broadcom is joining the Applied Materials EPIC platform.

The two companies will focus on research and development to accelerate introduction of packaging technologies for next-generation AI chips, and will leverage Applied Materials' global network of innovation centers to drive co-innovation across the ecosystem. System designers will receive early access to materials and process equipment innovations.

Applied Materials designs, manufactures, and services specialized equipment and software used to build semiconductor chips and advanced displays. The collaboration responds to robust adoption of advanced packaging techniques needed to boost energy-efficient performance of AI systems.