SJ Semiconductor, a China-based chipmaker, has started construction of a CNY10 billion (approximately US$1.47 billion（約2400億円）) advanced chip packaging plant in Shanghai. The 3DIC facility will produce high-performance packaging for AI and data center processors, addressing demand for more sophisticated chip architecture in the rapidly growing AI hardware market.
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SJ Semiconductor has begun construction of a CNY10 billion (approx. US$1.47 billion（約2400億円）) 3DIC manufacturing project in Shanghai's Lingang New Area. The facility will expand the company's advanced packaging capacity for high-performance computing, AI, and data center chips.
Why it matters
Advanced packaging (3DIC, or three-dimensional integrated circuits) is a critical technology for building more powerful AI chips with higher performance density. Expanding this capacity domestically may strengthen China's ability to produce competitive AI hardware amid global chip supply constraints.
What to watch
The project is located in Shanghai's Lingang New Area, a designated advanced manufacturing zone. This is SJ Semiconductor's investment in domestic 3DIC capacity, a segment historically dominated by a small number of advanced manufacturers.
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