AMD commits over $10 billion to Taiwan advanced packaging capacity and partnerships, aligning with 6th Gen EPYC Venice CPU production on TSMC's 2nm node

AMD is committing over $10 billion to expand advanced packaging capacity and AI partnerships across Taiwan, with the investment tied to production ramp of its 6th Gen EPYC "Venice" CPUs on TSMC's 2nm node.

The spending targets 2.5D and bridge interconnect packaging technology needed for multi-chip modules that combine CPUs, GPUs and memory, with local partners including ASE, SPIL and PTI, to secure supply for large AI and cloud systems.

The move is intended to support AMD's competitive position against Intel, Nvidia and custom chips from cloud providers by locking in manufacturing capacity and know-how for next generation AI infrastructure, though execution risks include whether AI infrastructure demand and share gains track current expectations.