ASE presented its strategy for next-generation AI infrastructure at the 2026 OCP APAC Summit, emphasizing that advances in packaging, optics, and power delivery are essential to scaling AI systems globally.
The move reflects industry recognition that rising demand for AI infrastructure requires fundamental rethinking of how chipmakers and data-center operators design and build systems to manage computing costs, energy consumption, and bandwidth.
What happened
At the 2026 OCP APAC Summit, ASE outlined the role of next-generation packaging, optics, and power delivery in scaling AI systems for global markets.
Why it matters
Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for computing costs, energy use, and bandwidth worldwide.
What to watch
The three pillars—packaging, optics, and power delivery—are positioned as critical to meeting the infrastructure requirements of AI scaling globally.
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The announcement reflects a broader industry reality: the explosion in AI workloads has exposed limitations in current infrastructure architecture. Chipmakers and data-center operators can no longer rely on incremental improvements to existing designs. Instead, they must fundamentally reconsider how systems are assembled and operated to handle the computational and power demands of AI at scale.
ASE's focus on three distinct pillars—packaging, optics, and power delivery—suggests that no single innovation will solve the problem. Packaging efficiency determines how closely and effectively components can be integrated; optics handle the massive data movement between processors and memory; and power delivery ensures systems can sustain the electrical loads required. Each domain faces distinct engineering challenges, and solving them in concert is essential for the next wave of AI infrastructure deployment.
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