AMD announces over $10 billion investment in Taiwan to scale advanced packaging manufacturing and AI infrastructure

On May 21, Advanced Micro Devices announced a strategic investment of over $10 billion across the Taiwan ecosystem, collaborating with ASE, SPIL, and PTI to qualify wafer-based 2.5D bridge interconnect technology and panel-based EFB interconnect for next-generation AI infrastructure.

These packaging innovations will support the AMD Helios rack-scale platform, powered by AMD Instinct MI450X GPUs and 6th Gen AMD EPYC 'Venice' CPUs, designed to improve bandwidth and power efficiency for high-performance, energy-efficient data center solutions.

The AMD Helios platform is on track for multi-gigawatt deployments in the second half of 2026, transitioning to high-volume manufacturing with support from ODM and substrate partners including Sanmina, Wiwynn, Inventec, and Unimicron.