Nvidia, Amkor sign $1.5B U.S. chip packaging deal

Nvidia, the semiconductor company that designs graphics processors and AI computing systems, has signed a multi-year agreement with Amkor Technology, a chip packaging and testing provider, valued at $1.5 billion（約2400億円）. Under the deal, Nvidia will make a prepayment to support Amkor's expansion of U.S. operations, with specific capacity additions planned in Arizona.

The core of the agreement centers on joint development of advanced packaging and testing technologies. These technologies will focus on integrating different types of chips into a single package—a key requirement for advanced data center systems running AI workloads. Amkor already provides packaging services for parts of Nvidia's product portfolio, including data center processors, and the expanded agreement is intended to bring additional packaging technologies to market as demand for AI infrastructure continues to rise.

The partnership strengthens Amkor's role in the U.S. semiconductor supply chain at a moment when onshore capacity is becoming a strategic priority. In June, Amkor entered a separate 10-year partnership with Taiwan Semiconductor Manufacturing to expand domestic packaging capabilities. Amkor also works with Advanced Micro Devices, diversifying its customer base. Following the announcement of the Nvidia deal, Amkor shares rose 17% in extended trading, reflecting market confidence in the agreement.

Investors are now watching how quickly the companies will add capacity and whether U.S.-based packaging can ease supply constraints for advanced AI systems—a critical question as demand for AI infrastructure accelerates.

Nvidia's $1.5 billion（約2400億円） prepayment deal with Amkor reflects the semiconductor industry's push to secure and expand advanced packaging capacity within the United States as AI infrastructure demand accelerates. The agreement builds on an existing relationship in which Amkor already packages Nvidia's data center processors, and now extends into jointly developed technologies for integrating multiple chip types—a critical capability for advanced data center systems. This move occurs alongside Amkor's June partnership with Taiwan Semiconductor Manufacturing, a 10-year commitment to domestic packaging expansion, signaling a broader industry realignment toward U.S.-based supply chain infrastructure.

The deal's emphasis on U.S. capacity in Arizona aligns with policy pressure for onshore semiconductor manufacturing and testing. By prepaying for capacity expansion, Nvidia gains supply security while Amkor strengthens its position as a specialized provider for high-end AI systems. The immediate 17% surge in Amkor's stock reflects investor confidence that the agreement will translate into sustained revenue and market share gains as AI workloads grow.

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