AI is driving the semiconductor industry's biggest growth inflection, says Applied Materials' CEO.
About 80% of this year's equipment growth ties to AI areas.
The company's packaging business grows over 50%.
What happened
Applied Materials CEO Gary Dickerson said AI is driving the semiconductor industry's most consequential growth inflection, with about 80% of this year's growth in wafer-fab equipment tied to AI-driven areas like advanced logic, high-bandwidth memory, and advanced packaging.
Why it matters
Dickerson said this AI cycle is more pervasive than prior transitions, including mainframes to PCs and mobile computing, because demand comes not only from people but also from AI agents consuming compute capacity. The company's advanced-packaging business is growing by more than 50% this year.
What to watch
Applied Materials is investing $5 billion in its EPIC Center in Silicon Valley to speed commercialization. Dickerson said an advanced package next year could contain more than 300 chips, more than 500 billion transistors, and more than 2,000 miles of wiring.
Ask the AI about this article →
Applied Materials' CEO is framing AI as a once-in-a-lifetime opportunity for the semiconductor industry, claiming it will touch every individual and transform every industry. This is not just about software or data centers, but about reshaping how chip equipment is developed and sold. The company's internal AI use is aimed at accelerating product development and services, with the service business growing at a 20% compound annual growth rate.
The emphasis on "tokens per second per watt" and cost per token highlights a shift toward efficiency in AI computing. Achieving these goals requires innovation across the tech stack, including advanced logic, faster memory, and advanced packaging. This is why Applied Materials is investing heavily in the EPIC Center, to foster collaboration and speed up commercialization. The company holds the No. 1 position in each of the AI-driven segments it highlighted.
Dickerson's comments suggest that the industry's focus is moving beyond just producing more chips to innovating in materials and architectures. The mention of more than 300 chips in a single advanced package next year underscores the complexity and scale of these developments. This is a strategic push to secure design wins and guide R&D investment, potentially shaping the industry's direction for years.
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