Apple's self-designed AI server chip Baltra expected to be manufactured by TSMC using N3E process

Apple and Broadcom are collaborating on an AI server chip codenamed Baltra, which is expected to be manufactured by TSMC using the N3E process (the second-generation 3nm fabrication technology).

The Baltra chip is likely to use Samsung Electro-Mechanics' semiconductor glass substrate, with Samsung having already provided samples to Apple.

Baltra is expected to be first deployed in Apple's security-focused cloud infrastructure to provide cloud computing services and reduce reliance on expensive NVIDIA GPUs, thereby lowering data center operating costs.