K&S expands advanced packaging roadmap for CPO, CoPoS growth

K&S's expanded TCB roadmap responds to growing complexity in advanced packaging. Traditional packaging methods face limits as chip designs incorporate more heterogeneous components. TCB offers finer pitch connections needed for integrating chiplets and photonics. CPO and CoPoS represent next-generation approaches. CPO aims to bring optics closer to compute to improve bandwidth and power efficiency. CoPoS addresses the challenge of stacking multiple dies with high interconnect density. K&S's focus on these areas suggests the company expects demand to rise alongside AI infrastructure buildouts. Success depends on industry adoption of these architectures, which could shape future packaging equipment demand.