AIToday
AI Business & IndustryDIGITIMES AsiaPublished: Oct 10, 2026, 22:01 JST

Yole analyst: advanced packaging to drive Malaysia chip growth

Yole analyst: advanced packaging to drive Malaysia chip growth

Yole Group analyst Nur Hilwani said Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added advanced packaging, which is set to drive growth over the next two to three years.

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