AI optical interconnects move into racks as 400G/lane and CPO mature

DIGITIMES observes that as AI systems scale, the demand for interconnectivity inside data centers has expanded beyond individual components. This progression from chips to racks and beyond signals a growing reliance on optical solutions at higher levels of the infrastructure stack. The mention of 400G/lane and CPO as key variables suggests that the industry is at a decision point where the maturity of these technologies will shape the next phase of AI data center buildouts. For business readers, this implies that investments and architectural choices in AI infrastructure will increasingly depend on optical interconnect performance, potentially affecting supply chains and technology roadmaps.