
What happened
Sodick said it will raise capacity for ultra-precision injection molding machines for optical communication connectors starting July 2027 and targets roughly 3× its 2026 injection molding machine shipment volume by 2028, up from about 900 units planned for 2026.
Why it matters
The expansion is a direct response to demand for the machines, implying Sodick expects connector makers to keep investing in production equipment as AI data centers drive high-speed optical communications.
WHO IT HITSThis matters most for procurement and manufacturing teams at electronic component makers that buy ultra-precision molding equipment for optical connectors, who could see more available supply from 2027 onward, and for Sodick's own production planning staff managing the three-site setup.
Summaries like this, every morning.
Sodick's move comes as AI data centers generate massive data traffic between servers, which requires high-speed optical communication and, in turn, optical connectors. Demand for those connectors has been growing worldwide, and Sodick says inquiries for its ultra-precision injection molding machines for optical connectors have expanded to roughly 300% of the previous year's level.
The company plans to increase capacity in stages from July 2027, focusing on three machine models. Rather than building new facilities, Sodick will optimize and streamline part of the machining production areas at its existing plants in Japan, Thailand, and China. In 2026, it expects to ship about 900 injection molding machines in total, and by 2028 it aims to roughly triple that volume. The addition of the Xiamen plant is intended to make the supply system more flexible and responsive to global demand.
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