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Marvell's Will Chu: skipping 7 nanometer fueled cloud AI lead

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Marvell's Will Chu: skipping 7 nanometer fueled cloud AI lead

3 Key Points

  1. What happened

    Marvell's Will Chu said the chipmaker skipped 7 nanometer back in 2018–2019, jumping to 5 nanometer and then 3, 2 nanometer and 14 angstrom, which he called the foundation for its cloud leadership.

  2. Why it matters

    Chu said being a leader rather than a follower in process nodes was necessary for data infrastructure, and he described the current AI buildout as the biggest CapEx in human history.

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Context & Analysis

Marvell's decision to skip a process node was a departure from the industry's usual step-by-step progression, and Chu frames it as a deliberate bet on becoming a leader rather than a follower in data infrastructure. He noted that the company had products at 12 and 16 nanometer, and the next logical step would have been 7 nanometer — which it bypassed entirely. That choice, he said, underpinned its subsequent moves to 5, 3, 2 nanometer and 14 angstrom.

Lazovsky explained that roughly 85% of total data transmission happens inside scale-up networks, with only 15% across scale-out, which is why Marvell is pushing optics into processor-to-processor links. The company's August Photonic Fabric Memory Module and September 2-nanometer optical interconnect technologies are aimed at decoupling memory capacity from compute and reducing total power consumption, respectively. These advances sit alongside Nvidia's $2 billion investment in Marvell earlier this year and a recent agreement to design custom AI chips for Google.

FAQ
What process nodes did Marvell skip and pursue?
Will Chu said Marvell skipped 7 nanometer, jumping from 12 and 16 nanometer products straight to 5 nanometer, then 3 nanometer, 2 nanometer and 14 angstrom.
What did Marvell announce in September?
Marvell unveiled 2-nanometer optical interconnect technologies designed to support AI scale-up architectures.
What did Marvell announce in August regarding memory?
Marvell announced a Photonic Fabric Memory Module that combines DDR5 memory, high-bandwidth memory caching and optical connectivity to share memory across AI systems.
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