AMD announces more than $10 billion in investments across Taiwan ecosystem to expand advanced packaging capabilities for AI infrastructure

AMD is investing more than $10 billion across the Taiwan ecosystem, collaborating with Taiwan-based ASE and SPIL and other industry partners to develop next-generation wafer-based 2.5D bridge interconnect technology for AI infrastructure.

The technology, called EFB (edge-to-edge bonding), increases interconnect bandwidth and improves power efficiency, supporting AMD's 6th Gen EPYC CPUs codenamed "Venice" to deliver greater performance-per-watt within real-world power and cooling constraints.

AMD's Helios rack-scale platform combining "Venice" CPUs and AMD Instinct MI450X GPUs (graphics processors) is on track for multi-gigawatt deployments beginning in the second half of 2026.