DIGITIMES points to three memory paths for AI accelerators

DIGITIMES's identification of three memory directions for cloud AI accelerators — processing near memory, 3D Stacked SRAM, and high-bandwidth flash — positions the discussion as a move away from a single memory approach. The mention of "From cHBM to" in the title suggests cHBM is the starting point the report contrasts with, while "memory architecture innovation" signals that the change is about how memory is designed into the accelerator, not just capacity. The three directions are presented as parallel paths rather than a single recommendation. For chip designers and cloud AI accelerator product planners, the practical effect is a wider design space: they may need to compare near-memory processing, 3D Stacked SRAM, and high-bandwidth flash against cHBM based on power and bandwidth targets, though the body does not provide cost, performance, or availability details. The overall takeaway hinges on whether these three paths move from concept to shipping products, and which one cloud providers and accelerator vendors actually adopt.