ASML's High-NA EUV Gains Traction as Intel Processes 1 million wafers

ASML's role in the AI infrastructure boom is often overlooked because investors focus on chip designers like Nvidia and cloud giants like Microsoft. But ASML is the only commercial supplier of EUV lithography systems, which are essential for manufacturing advanced semiconductors. The company is now preparing for the next generation with High-NA EUV, a more advanced version of its technology. In September, ASML announced expanded collaborations with Intel Foundry, Samsung, and TSMC to accelerate adoption. Intel has already processed more than 1 million wafers using High-NA EUV, and Samsung plans to introduce it into DRAM memory manufacturing by 2028. TSMC intends to use it for high-volume manufacturing starting in 2030. These partnerships position ASML at the center of the AI chip supply chain. Financially, ASML is delivering strong returns. When it reports third-quarter results on Oct. 14, analysts expect revenue of 11.68 billion euros ($13.1 billion), a 55% gain from a year earlier, with earnings of 10.66 euros per share. However, ASML faces risks such as semiconductor spending cycles, export restrictions, and high development costs. Still, its technological leadership creates a competitive moat that may benefit long-term investors.